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Description
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Designed for DDR5-enabled AMD AM5 platforms, Flare X5 series DDR5 memory is built for high performance in a low-profile design. Featuring AMD EXPO overclocking profiles for easy memory overclocking, users can easily enable overclocked performance by simply enabling EXPO in the BIOS on compatible systems.
Designed for AMD, Engineered for Performance
Created from high-quality hand-screened DDR5 DRAM ICs, Flare X5 memory kits are designed for performance on AMD platforms. Featuring AMD EXPO (EXtended Profiles for Overclocking) profiles, Flare X5 allows simple one-step memory overclocking through BIOS on supported motherboards.
Matte Minimalism
Available in anodized matte black, the Flare X5 memory module features a minimalistic design inspired by classic racing stripes and grills, and is ideal for a variety of build themes with its simple design.
Created for Quality
Each Flare X5 memory kit is created with hand-screened ICs and tested under G.SKILL’s rigorous validation process to ensure outstanding quality.
Compact Low-Profile Design
Featuring a low-profile height of just 33mm, the Flare X5 is an ideal choice for compact PC builds or systems with large CPU coolers.
AMD EXPO Support
Just set and go. Programmed with AMD EXPO overclocking profiles, the only thing that stands between you and awesome performance is a simple BIOS setting.
Limited Lifetime Warranty
All G.SKILL memory products come with a limited lifetime warranty and the G.SKILL technical team is always ready to provide consumers with complete technical support via online forum, telephone, and email.
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Crucial 240-pin DIMMs are used in DDR3 memory for desktop computers. DDR3 is the latest generation of memory with an improved architecture that allows it to transmit data more quickly.
A dual inline memory module (DIMM) consists of a number of memory components (usually black) that are attached to a printed circuit board (usually green). The gold pins on the bottom of the DIMM provide a connection between the module and a socket on a larger printed circuit board. The pins on the front and back of a DIMM are not connected to each other.
Each 240-pin DIMM provides a 64-bit data path (72-bit for ECC or registered or Fully Buffered modules). (The Ballistix™ and Ballistix Tracer™ high-performance memory do not come in 72-bit or registered modules.) Standard DDR3 240-pin DIMMs are currently available in PC3-8500 (DDR3 1066MHz) and PC3-10600 (DDR3 1333MHz) speeds. Additional speeds will be added as the technology becomes available.
To use DDR3 memory, your system motherboard must have 240-pin DIMM slots and a DDR3-enabled chipset. This is because a DDR3 SDRAM DIMM will not fit into a standard DDR2 DIMM socket or a DDR DIMM socket.
The number of black components on a 240-pin DIMM can vary, but it always has 120 pins on the front and 120 pins on the back, for a total of 240. 240-pin DIMMs are approximately 5.25 inches long and 1.18 inches high, though the heights can vary. While 240-pin DDR3 DIMMS, 240-pin DDR2 DIMMs, 184-pin DDR DIMMs, and 168-pin DIMMs are approximately the same size, 240-pin DIMMs and 184-pin DIMMs have only one notch within the row of pins.
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Has your server been configured with the memory it needs to perform as its role expands over time? HPE Server Memory is designed for SMB and enterprise customers with a significant need for performance and capacity, along with a desire to manage total cost of ownership. HPE SmartMemory enables total server memory optimization, runs at top throughput speed, and is among the most power-efficient memory available. In addition to performance and efficiency, HPE SmartMemory also delivers on reliability. Only the highest-quality DRAM modules are selected from top suppliers. Now more than ever, DRAM quality is critical, as data center trends such as server virtualization, cloud computing, and the use of large database applications have increased the need for higher-capacity memory with greater up-time. HPE SmartMemory undergoes rigorous qualification and testing processes that unlock memory performance features available only with HPE servers.
High Performance
HPE DDR4 2933 MT/s SmartMemory provides improvements in bandwidth in comparison to DDR4 2666 MT/s memory modules.
HPE DDR4 SmartMemory delivers improvements in latency at 2933 MT/s in comparison to DDR4 2666 MT/s memory modules.
High Reliability
Hewlett Packard Enterprise tests and qualifies HPE DDR4 SmartMemory modules on all HPE server platforms to deliver the highest level of signal integrity.
HPE DDR4 SmartMemory prevents unnecessary DIMM replacement and reduces server downtime with advanced memory error detection technology.
HPE uses the highest quality materials for its DDR4 server memory, reducing issues that may affect signal integrity and increasing system reliability.
HPE provides server memory that performs above industry standards, enabling customers to increase the performance of their servers without having to increase the amount of memory purchased.
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Origin Storage Matched Memory solutions are 100% guaranteed compatible for the target system, come with a lifetime warranty and are only manufactured using components from the top global manufacturers. Origin Matched Memory enables a cost effective upgrade process no matter the situation, whether your clients are re-purposing existing infrastructure or purchasing new systems looking to utilise the benefits offered by using compatible solutions vs the OEM Original. Origin Matched Memory is available in a wide breadth of generations covering DDR2, 3 & 4, and also in a variety of form factors covering SODIMM, FBDIMM, UDIMM, RDIMM and LRDIMM meaning that we can supply memory for nearly any laptop, desktop or server configuration.
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VENGEANCE LPX memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the eight-layer PCB helps manage heat and provides superior overclocking headroom.
DESIGNED FOR HIGH-PERFORMANCE OVERCLOCKING
VENGEANCE LPX memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the custom performance PCB helps manage heat and provides superior overclocking headroom. Each IC is individually screened for peak performance potential.
COMPATIBILITY TESTED
Part of our exhaustive testing process includes performance and compatibility testing on nearly every motherboard on the market – and a few that aren’t.
XMP 2.0 SUPPORT
One setting is all it takes to automatically adjust to the fastest safe speed for your VENGEANCE LPX kit. You’ll get amazing, reliable performance without lockups or other strange behavior.
ALUMINUM HEAT SPREADER
Overclocking overhead is limited by operating temperature. The unique design of the VENGEANCE LPX heat spreader optimally pulls heat away from the ICs and into your system’s cooling path, so you can push it harder.
DESIGNED FOR HIGH-PERFORMANCE OVERCLOCKING
Each VENGEANCE LPX module is built from an custom performance PCB and highly-screened memory ICs. The efficient heat spreader provides effective cooling to improve overclocking potential.
LOW-PROFILE DESIGN
The small form factor makes it ideal for smaller cases or any system where internal space is at a premium.
MATCH YOUR SYSTEM
The best high-performance systems look as good as they run. VENGEANCE LPX is available in several colors to match your motherboard, your other components, your case -- or just your favorite color.
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Short Description
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DDR5-5600MT/s, 1.25V, 48GB (2x24GB), AMD EXPO
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16GB, 240-pin DIMM, DDR3 PC3-12800, ECC, 2048Meg x 72, 1.35V
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1x 64GB, DDR4-2933, CAS-21-21-21, 1.2 V
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Origin Storage 64GB DDR4 2933MHz RDIMM 2Rx4 ECC 1.2V
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64 GB, 2 x 32 GB, 3200 MHz, DDR4, CL16
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32GB DDR4, 288-pin DIMM, 2400MHz, Load reduced
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